Language: 简体中文 English
Plenary Speaker

Sheng Liu

Wuhan University

2019/4/26 10:23:46

Sheng Liu

Liu Sheng, born in 1963, is a distinguished professor of Chang Jiang Scholars. He got PhD from US Stanford University and worked as a teacher in Florida Institute of Technology from 1992 to 1995. He worked as a tenured professor in the Department of Mechanical Engineering and Manufacturing Research Institute of Wayne State University from 1995 to 2001 and the director of Electronic Packaging Laboratory. He has been a distinguished professor of Chang Jiang Scholars from May, 2004 to now, a distinguished professor of Huazhong University of Science and Technology, a professor of Huazhong University of Science and Technology, principal of MEMS Research Center, the principal of Microsystem Research Center of Wuhan National Laboratory for Optoelectronics (preparatory). He was a member of general expert group for major special project MEMS of MOST from May, 2002 to 2006, a member of general expert group for major project semiconductor lighting of MOST from November, 2006 to now, and a member of subject expert group for AMT field of National High Technology Research and Development Program (863 program). He was among the first batch of talents selected into “Thousand Talents Program” in 2009. He was elected as ASME Fellow in 2009, and he is the vice-chairman of Chinese Association for Science & Technology, USA, and the contact of Chinese Electronics Packaging Society in North America.

His primary research fields include microelectronics, photoelectron, LED, MEMS, automobile electronic system packaging and assembling, rapid reliability evaluation and design, micro-scale measuring and computer aided design of MEMS, IC and PCB design, advanced materials and mechanics etc. His research has won the great support from US NSF and SRC, China major fund NSFC, 863 program, 973 program, major special project of National IC equipment and domestic and abroad industrial community.

He published more than 700 articles both nationally and internationally, among which 512 articles were included by SCI/EI. He has applied for and was authorized with more than 280 China patents and US patents. He organized and directed 6 international conferences. He was a chief author of 2 English monographs and involved in the writing of 5 monographs. He was awarded with Professor Award by the President of White House (1995), ASME Young Engineer Award (1996), Technical Contribution Award by International Microelectronics and Packaging Society (IMAPS) (1997), National Outstanding Youth Foundation (B) (1999), NSF Young Scientist Award (1995), the distinguished professor of Chang Jiang Scholars (2004), IEEE CPMT Exceptional Technical Achievement Award (2009), Special Achievement Award for Electronic Packaging by The Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics (2009), the first prize of China Federation of Logistics & Purchasing (2009), Electronic Information Science and Technology Award by Chinese Institute of Electronics (2009), and the fourth Returned Overseas Chinese Contribution Award – Innovation Achievement (2012).

  • DAYS
Key Dates
Conference date:
    October 11-14, 2019 
Abstract deadline:
    June 30, 2019 
Full paper submission date:
    October 11, 2019 
Online registration date:
    Before October 11, 2019
On-site registration date:
    October 11, 2019